LP8754_15 datasheet(5/53 Pages) TI

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LP8754

www.ti.com

SNVS861A – FEBRUARY 2014 – REVISED AUGUST 2014

6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

INPUT VOLTAGE

Voltage on Power Connections (VIOSYS, VDDA5V, VINBXX)

−0.3

Voltage on Logic pins (Input or Output pins) (SCLSYS, SDASYS, NRST,

−0.3

NSLP, ADDR, INT, SCLSR, SDASR)

Buck switch nodes (SWBXX)

−0.3

(VVINBXX + 0.2 V) with 6 V max

VLDO, FBB0+/B0, FBB0

−/B1, FBB2, FBB3+/B3, FBB3−/B4, FBB5

−0.3

All other analog pins

−0.3

TEMPERATURE

Junction Temperature (TJ-MAX)

150

°C

Maximum Lead Temperature (Soldering, 10 s)(3)

260

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground pin.

(3)

For detailed soldering specifications and information, please refer to Application Note 1112: DSBGA Wafer-Level Chip-Scale Package

(AN-1112).

6.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

−65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC

–1000

1000

JS-001, all pins(2)

Electrostatic

V(ESD) (All pins)

(1)

discharge

Charged device model (CDM), per JEDEC

–250

250

specification JESD22-C101, all pins(3)

(1)

Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in

to the device.

(2)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(3)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

INPUT VOLTAGE

Voltage on power connections (VDDA5V, VINBXX)

2.5

Voltage on VIOSYS

1.8

smaller of 3.3

V or VVINBXX

SCLSYS, SDASYS, ADDR

VVIOSYS

SCLSR, SDASR, NSLP, INT

VNRST

NRST

1.8

TEMPERATURE

Junction temperature (TJ)

−40

125

°C

Ambient temperature (TA)

−40

(1)

All voltage values are with respect to network ground pin.

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