ADG5243F datasheet(24/30 Pages) AD

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ADG5243F

Data Sheet

Rev. 0 | Page 24 of 30

TERMINOLOGY

IDD

IDD represents the positive supply current.

ISS

ISS represents the negative supply current.

IPOSFV

IPOSFV represents the positive secondary supply current.

INEGFV

INEGFV represents the negative secondary supply current.

VD represents the analog voltage on the Dx pins.

VS represents the analog voltage on the Sx pins.

RON

RON represents the ohmic resistance between the Dx pins and

the Sx pins.

∆RON

∆RON represents the difference between the RON of any two

channels.

RFLAT(ON)

RFLAT(ON) is the flatness that is defined as the difference between

the maximum and minimum value of on resistance measured

over the specified analog signal range.

IS (Off)

IS (off) is the source leakage current with the switch off.

ID (Off)

ID (off) is the drain leakage current with the switch off.

ID (On), IS (On)

ID (on) and IS (on) represent the channel leakage currents with

the switch on.

VINL

VINL is the maximum input voltage for Logic 0.

VINH

VINH is the minimum input voltage for Logic 1.

IINL, IINH

IINL and IINH represent the low and high input currents of the

digital inputs.

CD (Off)

CD (off) represents the off switch drain capacitance, which is

measured with reference to ground.

CS (Off)

CS (off) represents the off switch source capacitance, which is

measured with reference to ground.

CD (On), CS (On)

CD (on) and CS (on) represent the on switch capacitances, which

are measured with reference to ground.

CIN

CIN is the digital input capacitance.

tON (EN)

tON (EN represents the delay between applying the digital

control input and the output switching on (see Figure 45).

tOFF (EN)

tOFF (EN) represents the delay between applying the digital

control input and the output switching off (see Figure 45).

tTRANSITION

tTRANSITION represents the delay time between the 50% and 90%

points of the digital inputs and the switch on condition when

switching from one switch state to another.

tD represents the off time measured between the 80% points of

both switches when switching from one state to another.

tDIGRESP

tDIGRESP is the time required for the FF pin to go low (0.3 V),

measured with respect to the voltage on the source pin

exceeding the supply voltage by 0.5 V.

tDIGREC

tDIGREC is the time required for the FF pin to return high,

measured with respect to the voltage on the Sx pin falling below

the supply voltage plus 0.5 V.

tRESPONSE

tRESPONSE represents the delay between the source voltage

exceeding the supply voltage by 0.5 V and the drain voltage

falling to 90% of the supply voltage.

tRESPONSE(EN)

tRESPONSE(EN) represents the delay between the enable pin being

asserted and the drain reaching 90% of POSFV or NEGFV for a

switch that is in fault.

tRECOVERY

tRECOVERY represents the delay between an overvoltage on a Sx pin

falling below the supply voltage plus 0.5 V and the drain voltage

rising from 0 V to 10% of the supply voltage.

Off Isolation

Off isolation is a measure of unwanted signal coupling through

an off switch.

Charge Injection

Charge injection is a measure of the glitch impulse transferred

from the digital input to the analog output during switching.

Channel to Channel Crosstalk

Channel to channel crosstalk is a measure of unwanted signal

that is coupled through from one channel to another as a result

of parasitic capacitance.

Insertion Loss

Insertion loss is the loss due to the on resistance of the switch.

−3 dB Bandwidth

−3 dB bandwidth is the frequency at which the output is

attenuated by 3 dB.

ADG5243F Datasheet(PDF) 24 Page - Analog Devices

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