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BM63 Datasheet(PDF) 47 Page - Microchip Technology |
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BM63 Datasheet(HTML) 47 Page - Microchip Technology |
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47 / 56 page  2016 Microchip Technology Inc. Advance Information DS60001431A-Page 47 BM63 9.0 SOLDERING RECOMMENDATIONS The BM63 module is assembled using a standard lead-free reflow profile, IPC/JEDEC J-STD-020. The BM63 module can be soldered to the main PCB using a standard leaded and lead-free solder reflow profiles. To avoid any damage to the module, follow these rec- ommendations: • Refer to the “AN233 Solder Reflow Recommenda- tion” (DS00233) document for the soldering reflow recommendations • The peak temperature should not exceed (TP) of +250 ºC • Refer to the “Solder Paste” data sheet for specific reflow profile recommendations • Use no-clean flux solder paste • Do not wash the module as moisture can be trapped under the shield • Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. Figure 9-1 illustrates the reflow profile of the BM63 module. FIGURE 9-1: REFLOW PROFILE |
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