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LP5521 Datasheet(PDF) 2 Page - Texas Instruments

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Part # LP5521
Description  LP5521 Programmable Three-Channel LED Driver
PDF  48 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LP5521 Datasheet(HTML) 2 Page - Texas Instruments

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LP5521
SNVS441H – JANUARY 2007 – REVISED MAY 2016
www.ti.com
Product Folder Links: LP5521
Submit Documentation Feedback
Copyright © 2007–2016, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Pin Configuration and Functions ......................... 3
6
Specifications......................................................... 5
6.1
Absolute Maximum Ratings ..................................... 5
6.2
ESD Ratings.............................................................. 5
6.3
Recommended Operating Conditions ....................... 5
6.4
Thermal Information .................................................. 6
6.5
Electrical Characteristics........................................... 6
6.6
Charge Pump Electrical Characteristics ................... 7
6.7
LED Driver Electrical Characteristics (R, G, B
Outputs) ..................................................................... 7
6.8
Logic Interface Characteristics.................................. 7
6.9
I2C Timing Requirements (SDA, SCL)...................... 8
6.10
Typical Characteristics ............................................ 9
7
Detailed Description ............................................ 11
7.1
Overview ................................................................. 11
7.2
Functional Block Diagram ....................................... 11
7.3
Feature Description................................................. 12
7.4
Device Functional Modes........................................ 18
7.5
Programming........................................................... 19
7.6
Register Maps ......................................................... 28
8
Application and Implementation ........................ 36
8.1
Application Information............................................ 36
8.2
Typical Applications ................................................ 36
8.3
Initialization Setup ................................................... 39
9
Power Supply Recommendations ...................... 40
10
Layout................................................................... 40
10.1
Layout Guidelines ................................................. 40
10.2
Layout Example .................................................... 40
11
Device and Documentation Support ................. 41
11.1
Device Support...................................................... 41
11.2
Documentation Support ........................................ 41
11.3
Community Resources.......................................... 41
11.4
Trademarks ........................................................... 41
11.5
Electrostatic Discharge Caution ............................ 41
11.6
Glossary ................................................................ 41
12
Mechanical, Packaging, and Orderable
Information ........................................................... 41
4 Revision History
Changes from Revision G (September 2014) to Revision H
Page
Added several new Applications ............................................................................................................................................ 1
Changed Body Size of DSBGA package to MAX dimensions .............................................................................................. 1
Changed Handling Ratings to ESD Ratings table ................................................................................................................. 5
Changed RθJA value for DSBGA from 50 – 90°C/W to 70.7°C/W and WQFN from 37 – 90°C/W to 38.4°C/W; add
additional thermal information ................................................................................................................................................ 6
Added Community Resources ............................................................................................................................................. 41
Changes from Revision F (February 2013) to Revision G
Page
Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section ................................................................................................................................................................................... 1



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