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OPA381 Datasheet(PDF) 2 Page - Texas Instruments

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Part # OPA381
Description  Precision, Low Power, 18MHz Transimpedance Amplifier
PDF  24 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

OPA381 Datasheet(HTML) 2 Page - Texas Instruments

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OPA381
OPA2381
SBOS313B − AUGUST 2004 − REVISED NOVEMBER 2004
www.ti.com
2
ABSOLUTE MAXIMUM RATINGS(1)
Voltage Supply
+7V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Signal Input Terminals(2), Voltage
(V−) −0.5V to (V+) + 0.5V
. . . . .
Current
±10mA
. . . . . . . . . . . . . . . . . . . . .
Short-Circuit Current(3)
Continuous
. . . . . . . . . . . . . . . . . . . . . . . .
Operating Temperature Range
−40
°C to +125°C
. . . . . . . . . . . . . . .
Storage Temperature Range
−65
°C to +150°C
. . . . . . . . . . . . . . . . .
Junction Temperature
+150
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead Temperature (soldering, 10s)
+300
°C
. . . . . . . . . . . . . . . . . . . . .
OPA381 ESD Rating (Human Body Model)
2000V
. . . . . . . . . . . . . . .
OPA2381 ESD Rating (Human Body Model)
1500V
. . . . . . . . . . . . . .
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
(2) Input terminals are diode clamped to the power-supply rails. Input
signals that can swing more than 0.5V beyond the supply rails
should be current limited to 10mA or less.
(3) Short-circuit to ground; one amplifier per package.
ELECTROSTATIC DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
OPA381
MSOP-8
DGK
−40
°C to +125°C
A64
OPA381AIDGKT
Tape and Reel, 250
OPA381
MSOP-8
DGK
−40
°C to +125°C
A64
OPA381AIDGKR
Tape and Reel, 2500
OPA381
DFN-8
DRB
−40
°C to +125°C
A65
OPA381AIDRBT
Tape and Reel, 250
OPA381
DFN-8
DRB
−40
°C to +125°C
A65
OPA381AIDRBR
Tape and Reel, 3000
OPA2381
MSOP-8
DGK
−40
°C to +125°C
A62
OPA2381AIDGKT
Tape and Reel, 250
OPA2381
MSOP-8
DGK
−40
°C to +125°C
A62
OPA2381AIDGKR
Tape and Reel, 2500
OPA2381
DFN-8
DRB
−40
°C to +125°C
A63
OPA2381AIDRBT
Tape and Reel, 250
OPA2381
DFN-8
DRB
−40
°C to +125°C
A63
OPA2381AIDRBR
Tape and Reel, 3000
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
PIN ASSIGNMENTS
DFN−8
Top View
1
2
3
4
8
7
6
5
NC(1)
V+
Out
NC(1)
NC(1)
−In
+In
V
OPA381
MSOP−8
1
2
3
4
8
7
6
5
V+
Out B
In B
+In B
Out A
In A
+In A
V
OPA2381
MSOP−8
1
2
3
4
8
7
6
5
NC(1)
V+
Out
NC(1)
NC(1)
−In
+In
V
OPA381
Exposed
Thermal
Die Pad
on
Underside
1
2
3
4
8
7
6
5
V+
Out B
−In B
+In B
Out A
−In A
+In A
V
OPA2381
Exposed
Thermal
Die Pad
on
Underside
DFN−8
NOTE: (1) NC indicates no internal connection.



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