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MIC4600 Datasheet(PDF) 11 Page - Microchip Technology

Part # MIC4600
Description  28V Half-Bridge MOSFET Driver
PDF  26 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MIC4600 Datasheet(HTML) 11 Page - Microchip Technology

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 2016 Microchip Technology Inc.
DS20005584A-page 11
MIC4600
FIGURE 4-2:
Low-Side Driver Circuit.
4.2.6
HIGH-SIDE DRIVER AND
BOOTSTRAP CIRCUIT
A block diagram of the high-side driver and bootstrap
circuit is shown in Figure 4-3. This driver is designed to
drive a floating N-channel MOSFET, whose source
terminal is referenced to the SW pin. The output
voltage of the DH pin equals VDD minus the external
bootstrap diode forward voltage drop. The high-side
gate drive voltage is typically 4.5V.
A low-power, high-speed, level-shifting circuit isolates
the low side (AGND pin) referenced circuitry from the
high-side (SW pin) referenced driver. Power to the
high-side driver is supplied by the bootstrap circuit.
FIGURE 4-3:
High-Side Driver and
Bootstrap Circuit.
The bootstrap circuit consists of an external diode and
external capacitor, CB. In a typical application, such as
the synchronous buck converter shown in Figure 4-4,
the SW pin is at ground potential while the low-side
MOSFET is on. During this time, the diode allows
capacitor CB to charge up to VDD-VF (where VF is the
forward voltage drop of the diode). After the low-side
MOSFET is turned off and the DH pin goes high, the
voltage across capacitor CB is applied to the gate of the
upper external MOSFET. As the upper MOSFET turns
on, voltage on the SW pin rises with the source of the
high-side MOSFET until it reaches VIN. As the SW and
BST pins rise, the diode is reverse biased preventing
capacitor CB from discharging.
FIGURE 4-4:
MIC4600 Driving a
Synchronous Buck Converter.
4.2.7
THERMAL SHUTDOWN
Thermal shutdown protects the driver from damage
due to excessive die temperature. If the die exceeds
the high temperature threshold, the output drive is
inhibited and the FAULT pin is asserted low. The driver
automatically resumes operation, and the FAULT pin is
de-asserted, when the die temperature cools below the
lower threshold, set by the circuit’s hysteresis. If
resumed operation results in reheating of the die above
the high threshold, another shutdown cycle occurs.
The switch continues thermal cycling until the condition
has been resolved.
4.2.8
FAULT PIN
The FAULT signal is an N-channel open drain output,
which is asserted low when the MIC4600 enters
thermal shutdown.
PGND
VDD
DL
EXTERNAL
FET
SW
BST
DH
EXTERNAL
FET
VDD
C
B
V
IN
LEVEL
SHIFT



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