| Electronic Components Datasheet Search |
|
MIC4600 Datasheet(PDF) 11 Page - Microchip Technology |
|
|
|||||||||||||||||||||||||||||
MIC4600 Datasheet(HTML) 11 Page - Microchip Technology |
|
11 / 26 page ![]() 2016 Microchip Technology Inc. DS20005584A-page 11 MIC4600 FIGURE 4-2: Low-Side Driver Circuit. 4.2.6 HIGH-SIDE DRIVER AND BOOTSTRAP CIRCUIT A block diagram of the high-side driver and bootstrap circuit is shown in Figure 4-3. This driver is designed to drive a floating N-channel MOSFET, whose source terminal is referenced to the SW pin. The output voltage of the DH pin equals VDD minus the external bootstrap diode forward voltage drop. The high-side gate drive voltage is typically 4.5V. A low-power, high-speed, level-shifting circuit isolates the low side (AGND pin) referenced circuitry from the high-side (SW pin) referenced driver. Power to the high-side driver is supplied by the bootstrap circuit. FIGURE 4-3: High-Side Driver and Bootstrap Circuit. The bootstrap circuit consists of an external diode and external capacitor, CB. In a typical application, such as the synchronous buck converter shown in Figure 4-4, the SW pin is at ground potential while the low-side MOSFET is on. During this time, the diode allows capacitor CB to charge up to VDD-VF (where VF is the forward voltage drop of the diode). After the low-side MOSFET is turned off and the DH pin goes high, the voltage across capacitor CB is applied to the gate of the upper external MOSFET. As the upper MOSFET turns on, voltage on the SW pin rises with the source of the high-side MOSFET until it reaches VIN. As the SW and BST pins rise, the diode is reverse biased preventing capacitor CB from discharging. FIGURE 4-4: MIC4600 Driving a Synchronous Buck Converter. 4.2.7 THERMAL SHUTDOWN Thermal shutdown protects the driver from damage due to excessive die temperature. If the die exceeds the high temperature threshold, the output drive is inhibited and the FAULT pin is asserted low. The driver automatically resumes operation, and the FAULT pin is de-asserted, when the die temperature cools below the lower threshold, set by the circuit’s hysteresis. If resumed operation results in reheating of the die above the high threshold, another shutdown cycle occurs. The switch continues thermal cycling until the condition has been resolved. 4.2.8 FAULT PIN The FAULT signal is an N-channel open drain output, which is asserted low when the MIC4600 enters thermal shutdown. PGND VDD DL EXTERNAL FET SW BST DH EXTERNAL FET VDD C B V IN LEVEL SHIFT |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |