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MIC4600 Datasheet(PDF) 14 Page - Microchip Technology |
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MIC4600 Datasheet(HTML) 14 Page - Microchip Technology |
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14 / 26 page ![]() MIC4600 DS20005584A-page 14 2016 Microchip Technology Inc. 6.5 Power Dissipation Considerations Power dissipation in the driver can be separated into two areas: • Quiescent current dissipation • Internal driver dissipation 6.6 Quiescent Current Power Dissipation Power is dissipated in the MIC4600 even if nothing is being driven. The quiescent current is drawn by the bias for the internal circuitry and the level shifting circuitry. The quiescent current is proportional to operating frequency. The typical characteristic graphs show how quiescent current varies with switching frequency. The power dissipated due to quiescent current is calculated in Equation 6-5. EQUATION 6-5: 6.7 Gate Driver Power Dissipation Power dissipation in the output driver stage is mainly caused by charging and discharging the gate to source and gate to drain capacitance of the external MOSFET. Figure 6-1 shows a simplified equivalent circuit of the MIC4600 driving an external high-side MOSFET. FIGURE 6-1: MIC4600 Driving an External MOSFET. 6.7.1 DISSIPATION DURING THE EXTERNAL MOSFET TURN-ON Energy from capacitor CB is used to charge up the input capacitance of the MOSFET (CGD and CGS). The energy delivered to the MOSFET is dissipated in the three resistive components, RON, RG and RG_FET. RON is the on resistance of the upper driver MOSFET in the MIC4600. RG is the series resistor (if any) between the driver IC and the MOSFET. RG_FET is the gate resistance of the MOSFET. RG_FET is usually listed in the power MOSFET’s specifications. The ESR of capacitor CB and the resistance of the connecting etch can be ignored since they are much less than RON and RG_FET. The effective capacitances of CGD and CGS are difficult to calculate because they vary non-linearly with ID, VGS, and VDS. Fortunately, most power MOSFET specifications include a typical graph of total gate charge vs. VGS. Figure 6-2 is a typical gate charge curve for a power MOSFET. This chart shows that for a gate voltage of 4.5V, the MOSFET gate is charged up to 25 nC of total gate charge. The energy dissipated by the resistive components of the gate drive circuit during turn-on is calculated as noted in Equation 6-6 through . EQUATION 6-6: but: EQUATION 6-7: so: EQUATION 6-8: Where: CISS = Total gate capacitance of the MOSFET FIGURE 6-2: Typical Gate Charge vs. VGS. The same energy is dissipated by ROFF, RG, and RG_FET when the driver IC turns the MOSFET off. Assuming RON is approximately equal to ROFF, the total energy and power dissipated by the resistive drive elements is illustrated in Equation 6-9. P DISS _IQ V DD I DD = SW BST DH EXTERNAL FET VDD C B R G R G_FET R ON R OFF C GD C GS MIC4600 HIGH-SIDE DRIVER E 1 2 --- C ISS V GS 2 = QC V = E 1 2 --- Q G V GS = |
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