MIC4600

DS20005584A-page 20

 2016 Microchip Technology Inc.

16-Lead VQFN 3 mm x 3 mm Package Outline and Recommended Land Pattern

RECOMMENDED LAND PATTERN

Dimension Limits

Units

C2

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

Y2

X2

1.50

1.50

MILLIMETERS

0.50 BSC

MIN

E

MAX

2.60

Contact Pad Length (X16)

Contact Pad Width (X16)

Y1

X1

0.50

0.30

Microchip Technology Drawing C04-2404A

NOM

16-Lead Plastic Quad Flat, No Lead Package (8N) - 3x3x1.0 mm Body [VQFN]

SILK SCREEN

C1

Contact Pad Spacing

2.60

Contact Pad to Center Pad (X16)

G1

0.30

Thermal Via Diameter

V

Thermal Via Pitch

EV

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Wettable Flanks (Stepped), 0.35 mm Terminal Length

Contact Pad to Contact Pad (X12)

G2

0.20

C1

EV

EV

C2

E

X2

Y2

X1

Y1

G1

G2

ØV