FT4232HL datasheet(47/55 Pages) FTDI

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FT4232H QUAD HIGH SPEED USB TO MULTIPURPOSE UART/MPSSE IC

Datasheet

Version 2.4

Document No.: FT_000060 Clearance No.: FTDI#78

8.4 Solder Reflow Profile

Figure 8.4 FT4232H Solder Reflow Profile

Profile Feature

Pb Free Solder Process

(green material)

SnPb Eutectic and Pb free (non

green material) Solder Process

Average Ramp Up Rate (Ts to Tp)

3°C / second Max.

3°C / Second Max.

Preheat

- Temperature Min (Ts Min.)

- Temperature Max (Ts Max.)

- Time (ts Min to ts Max)

150°C

200°C

60 to 120 seconds

100°C

150°C

60 to 120 seconds

Time Maintained Above Critical Temperature

TL:

- Temperature (TL)

- Time (tL)

217°C

60 to 150 seconds

183°C

60 to 150 seconds

Peak Temperature (Tp)

260°C

see Table 8.3

Time within 5°C of actual Peak Temperature

(tp)

30 to 40 seconds

20 to 40 seconds

Ramp Down Rate

6°C / second Max.

Time for T= 25°C to Peak Temperature, Tp

8 minutes Max.

6 minutes Max.

Table 8.2 Reflow Profile Parameter Values

Critical Zone: when

T is in the range

T to T

Time, t (seconds)

T = 25º C to T

Preheat

Ramp Up

Ramp

Down

T Max

T Min

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