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AS3636 Datasheet(PDF) 3 Page - ams AG |
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AS3636 Datasheet(HTML) 3 Page - ams AG |
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3 / 42 page ![]() www.austriamicrosystems.com Revision 0.7 3 - 42 with additional features with photosensor AS3636 Preliminary Datasheet, Confidential - A b s o l u t e M a x i m u m R a t i n g s 5 Absolute Maximum Ratings Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Table 3, “Electrical Characteristics,” on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings Parameter Min Max Units Comments VBAT, VBATINT to GND -0.3 +7.0 V SDA, SCL, STROBE, INT, TORCH, IGBT_GATE, SW_B, VOUTBOOST, VLED, IND to GND -0.3 VBATIN T + 0.3 V max. 7.0V SW_F to GND -0.3 +55.0 V VOUTBOOST to SW_B -0.3 V Note: Diode between VOUTBOOST and SW_B SGND, DGND, PGND to GND 0.0 0.0 V Connect SGND, DGND and PGND to GND directly below the pad (short connection required) Input Pin Current without causing latchup -100 +100 +IIN mA Norm: EIA/JESD78 Continuous Power Dissipation (TA = +70ºC) Continuous power dissipation 1W PT 1 1. Depending on actual PCB layout and PCB used; for peak power dissipation during flashing see document 'AS3636 Thermal Measurements' Continuous power dissipation derating factor 14.7 mW/ºC PDERATE 2 2. PDERATE derating factor changes the total continuous power dissipation (PT) if the ambient temperature is not 70ºC. Therefore for e.g. TAMB=85ºC calculate PT at 85ºC = PT - PDERATE * (85ºC - 70ºC) Electrostatic Discharge ESD pins VBAT, SDA, SCL, STROBE, INT, TORCH ±15000 V Air Discharge to module; IEC 61000 -4 -2 test bench 3 3. Assembled on PCB board (requires capacitor CVBAT); system test for completed module (fully capsuled), no permanent interruption of operation; proper layout required ±8000 V Contact Test to module; IEC 61000 -4 -2 test bench 3 ESD HBM ±2000 V Norm: MIL 883 E Method 3015 ESD CDM ±500 V Norm: JEDEC JESD 22-C101C ESD MM ±100 V Norm: JEDEC JESD 22-A115-A level A Temperature Ranges and Storage Conditions Junction Temperature +150 ºC Internally limited (overtemperature protection) Storage Temperature Range -55 +125 ºC Humidity 5 85 % Non condensing Body Temperature during Soldering +260 ºC according to IPC/JEDEC J-STD-020C Fuse Fuse Melting time - IFUSE_LIMIT 1000 ms at 1.5A typ. 100 ms at 2A Fuse operating current - IFUSE 650 mA |
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