RH56D-PCI Modem Designer’s Guide

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Conexant

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Conexant Proprietary Information

3.

HARDWARE INTERFACE ................................................................................................................................. 3-1

3.1

HARDWARE SIGNAL PINS AND DEFINITIONS ..................................................................................... 3-1

3.2

POWER REQUIREMENTS AND MAXIMUM RATINGS......................................................................... 3-13

3.3

MDP ELECTRICAL CHARACTERISTICS.............................................................................................. 3-14

3.4

PCI BUS ELECTRICAL, SWITCHING, AND TIMING CHARACTERISTICS .......................................... 3-14

4.

DESIGN CONSIDERATIONS ............................................................................................................................. 4-1

4.1

PC BOARD LAYOUT GUIDELINES......................................................................................................... 4-1

4.1.1

General Principles...................................................................................................................... 4-1

4.1.2

Component Placement............................................................................................................... 4-1

4.1.3

Signal Routing............................................................................................................................ 4-2

4.1.4

Power ......................................................................................................................................... 4-3

4.1.5

Ground Planes ........................................................................................................................... 4-4

4.1.6

Crystal Circuit............................................................................................................................. 4-4

4.1.7

VC and VREF Circuit ................................................................................................................. 4-4

4.1.8

Telephone and Local Handset Interface .................................................................................... 4-5

4.1.9

Optional Configurations ............................................................................................................. 4-5

4.1.10

MDP Specific.............................................................................................................................. 4-5

4.2

CUSTOM DESIGN GUIDELINES FOR 2-LAYER PCI MODEM BOARD ................................................. 4-5

4.2.1

General Guidelines .................................................................................................................... 4-5

4.2.2

Placement of Modem Devices ................................................................................................... 4-6

4.2.3

Trace Routing and Length on PCI Signals................................................................................. 4-6

4.2.4

Grounding .................................................................................................................................. 4-6

4.2.5

Filtering ...................................................................................................................................... 4-6

4.2.6

Decoupling ................................................................................................................................. 4-7

4.2.7

Crystal Circuit............................................................................................................................. 4-7

4.2.8

Modem Analog Interface ............................................................................................................ 4-8

4.3

PCB LAYOUT EXAMPLES....................................................................................................................... 4-9

4.4

CRYSTAL/OSCILLATOR SPECIFICATIONS ........................................................................................ 4-11

4.5

OTHER CONSIDERATIONS.................................................................................................................. 4-11

4.6

PACKAGE DIMENSIONS....................................................................................................................... 4-14

5.

SOFTWARE INTERFACE .................................................................................................................................. 5-1

5.1

PCI CONFIGURATION REGISTERS ....................................................................................................... 5-1

5.1.1

0x00 - Vendor ID Field ............................................................................................................... 5-1

5.1.2

0x02 - Device ID Field................................................................................................................ 5-1

5.1.3

0x04 - Command Register ......................................................................................................... 5-2

5.1.4

0x06 - Status Register ............................................................................................................... 5-2

5.1.5

0x08 - Revision ID Field ............................................................................................................. 5-3

5.1.6

0x09 - Class Code Field............................................................................................................. 5-3

5.1.7

0x0D - Latency Timer Register .................................................................................................. 5-3

5.1.8

0x0E - Header Type Field .......................................................................................................... 5-3

5.1.9

0x28 - CIS Pointer Register ....................................................................................................... 5-3

5.1.10

0x2C - Subsystem Vendor ID Register ...................................................................................... 5-3

5.1.11

0x2E- Subsystem ID Register .................................................................................................... 5-3

5.1.12

0x34 - Cap Ptr ............................................................................................................................ 5-3

5.1.13

0x3C - Interrupt Line Register .................................................................................................... 5-3

5.1.14

0x3D - Interrupt Pin Register...................................................................................................... 5-3

5.1.15

0x3E - Min Grant Register.......................................................................................................... 5-3

5.1.16

0x3F - Max Latency Register ..................................................................................................... 5-3

5.1.17

0x40 - Capability Identifier ......................................................................................................... 5-3

5.1.18

0x41 - Next Item Pointer ............................................................................................................ 5-3

5.1.19

0x42 - PMC - Power Management Capabilities ......................................................................... 5-4

5.1.20

0x44 - PMCSR - Power Management Control/Status Register (Offset = 4)............................... 5-4

5.1.21

0x46 - PMCSR_BSE - PMCSR PCI to PCI Bridge Support Extensions..................................... 5-4

5.1.22

0x47 - Data ................................................................................................................................ 5-4