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AD7674ASTZ Datasheet(PDF) 11 Page - Analog Devices

Part # AD7674ASTZ
Description  18-Bit, 2.5 LSB INL, 800 kSPS, SAR ADC
PDF  29 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD7674ASTZ Datasheet(HTML) 11 Page - Analog Devices

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AD7674
Data Sheet
Rev. B | Page 10 of 28
Pin No.
Mnemonic
Type1
Description
32
CS
DI
Chip Select. When CS and RD are both low, the interface parallel or serial output bus is enabled. CS is
also used to gate the external clock.
33
RESET
DI
Reset Input. When set to a logic high, reset the AD7674. Current conversion, if any, is aborted. If not
used, this pin can be tied to DGND.
34
PD
DI
Power-Down Input. When set to a logic high, power consumption is reduced and conversions are
inhibited after the current one is completed.
35
CNVST
DI
Start Conversion. A falling edge on CNVST puts the internal sample/hold into the hold state and
initiates a conversion. In impulse mode (IMPULSE high, WARP low), if CNVST is held low when the
acquisition phase (t8) is complete, the internal sample/hold is put into hold and a conversion is
immediately started.
36
AGND
P
Must Be Tied to Analog Ground.
37
REF
AI
Reference Input Voltage and Internal Reference Buffer Output. Apply an external reference on REF if
the internal reference buffer is not used. Should be decoupled effectively with or without the internal
buffer.
38
REFGND
AI
Reference Input Analog Ground.
39
IN–
AI
Differential Negative Analog Input.
40 to
42
NIC
No Internal Connection.
43
IN+
AI
Differential Positive Analog Input.
45
DNC
Do Not Connect. Do not connect to this pin.
46
REFBUFIN
AI
Reference Buffer Input Voltage. The internal reference buffer has a fixed gain. It outputs 4.096 V
typically when 2.5 V is applied on this pin.
48
PDBUF
DI
Allows Choice of Buffering Reference. When low, buffer is selected. When high, buffer is switched off.
0
EPAD
Exposed Pad. The exposed pad is internally connected to AGND. This connection is not required to
meet the electrical performances. However, for increased reliability of the solder joints, it is
recommended that the pad be soldered to the analog ground of the system.
1AI = Analog Input; DI = Digital Input; DI/O = Bidirectional Digital; DO = Digital Output; P = Power.
Table 7. Data Bus Interface Definitions1
Mode
MODE1
MODE0
D0/OB/2C
D1/A0
D2/A1
D[3]
D[4:9]
D[10:11]
D[12:15]
D[16:17]
Description
0
0
0
R[0]
R[1]
R[2]
R[3]
R[4:9]
R[10:11]
R[12:15]
R[16:17]
18-bit parallel
1
0
1
OB/2C
A0:0
R[2]
R[3]
R[4:9]
R[10:11]
R[12:15]
R[16:17]
16-bit high word
1
0
1
OB/2C
A0:1
R[0]
R[1]
All zeros
16-bit low word
2
1
0
OB/2C
A0:0
A1:0
All high-Z
R[10:11]
R[12:15]
R[16:17]
8-bit high byte
2
1
0
OB/2C
A0:0
A1:1
All high-Z
R[2:3]
R[4:7]
R[8:9]
8-bit mid byte
2
1
0
OB/2C
A0:1
A1:0
All high-Z
R[0:1]
All zeros
8-bit low byte
2
1
0
OB/2C
A0:1
A1:1
All high-Z
All zeros
R[0:1]
8-bit low byte
3
1
1
OB/2C
All high-Z
Serial interface
Serial interface
1 R[0:17] is the 18-bit ADC value stored in its output register.



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