MAX77816 datasheet(2/26 Pages) MAXIM

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SYS to GND .........................................................-0.3V to +6.0V

INBB, OUTBB to PGNDBB ..................................-0.3V to +6.0V

PGNDBB to GND .................................................-0.3V to +0.3V

SCL, SDA to GND .................................. -0.3V to (VSYS + 0.3V)

EN, GPIO to GND .................................. -0.3V to (VSYS + 0.3V)

FB_BB to GND...................................-0.3V to (VOUTBB + 0.3V)

LXBB1 to PGNDBB............................... -0.3V to (VINBB + 0.3V)

LXBB2 to PGNDBB............................-0.3V to (VOUTBB + 0.3V)

LXBB1/LXBB2 Continuous RMS Current (Note 1) ..............4.8A

Operating Temperature Range........................... -40°C to +85°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Soldering Temperature (reflow).......................................+260°C

Continuous Power Dissipation at TA = +70°C

(Derate 23.8mW/°C above +70°C) ...........................1905mW

Junction-to-Ambient Thermal Resistance (θJA).........55.49°C/W

(Note 2)

Note 1: LXBB1/LXBB2 node has internal clamp diodes to PGNDBB and INBB. Applications that give forward bias to these diodes

should ensure that the total power loss does not exceed the power dissipation limit of IC package.

(VSYS = VINBB = +3.8V, VFB_BB = VOUTBB = +3.3V, TA = -40°C to +85°C, typical values are at TA = +25°C, unless otherwise noted.)

(Note 3)

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

Electrical Characteristics

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

GENERAL

Input Voltage Range

VINBB

2.3

5.5

Shutdown Supply Current

ISHDN_25C

EN = low, TA = +25°C

0.1

µA

ISHDN_85C

EN = low, TA = +85°C (Note 5)

Input Supply Current

IQ_SKIP

SKIP mode, no switching

µA

IQ_PWM

FPWM mode, no load

Active Discharge Resistance

RDISCHG

100

Thermal Shutdown

TSHDN

Rising, 20°C hysteresis

+165

°C

H-BRIDGE

Output Voltage Range

VOUT

I2C programmable (20mV step)

2.60

5.14

Default Output Voltage

VOUT[6:0] = 0x28

3.4

Output Voltage Accuracy

VOUT_ACC1

PWM mode,

VOUT[6:0] = 0x28, no load

-1.0

+1.0

VOUT_ACC2

SKIP mode, VOUT[6:0] = 0x28,

no load, TA = +25°C

-1.0

+4.5

Line Regulation

VINBB = 2.3V to 5.5V

0.200

%/V

Load Regulation

(Note 4)

0.125

%/A

Line Transient Response

VOS1

VUS1

IOUT = 1.5A, VINB changes from 3.4V

to 2.9V in 25µs (20mV/µs), L = 1µH,

COUT_NOM = 47µF (Note 4)

MAX77816

High-Efficiency Buck-Boost Regulator

with 5A Switches

www.maximintegrated.com

Maxim Integrated │ 2

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