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AS39513 Datasheet(PDF) 7 Page - ams AG |
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AS39513 Datasheet(HTML) 7 Page - ams AG |
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7 / 108 page ![]() ams Datasheet Page 7 [v1-10] 2018-Apr-25 Document Feedback AS39513 − Absolute Maximum Ratings Note(s): 1. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices”. RHOPEN_ DOF Relative Humidity for DOF/Die or Wafers on Foil in Open Package 15 % Opened package RHUNOPEN _DOF Relative Humidity for DOF/Die or Wafers on Foil in Sealed Package 40 60 % Sealed bag Symbol Parameter Min Max Unit Comments |
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