AS39513 datasheet(4/108 Pages) AMSCO

4 / 108 page

Page 4

ams Datasheet

Document Feedback

[v1-10] 2018-Apr-25

AS39513 − Pin and Pad Layout

The AS39513 can be shipped as bare die with gold bumps.

When packaged as a bare die, the pad arrangement is as

depicted below (measures are reported in μm).

Figure 3:

Bare Die with Gold Bumps Pinout

Note(s):

1. Bondpad spacing is ≥ 400

μm

Pin Description

Figure 4:

Pin Description of AS39513 with Gold Bumps

Pin Name

Pin Type

Description

SCLK

SPI CLK input

DOUT

Digital data output.

SEXT

Analog input for external sensor.

VBAT

Battery input.

DIN

Digital data input.

VSS

Negative supply and ground.

ATEST

Analog test output.

VEXT

Power output for external circuit, generated by RF field.

SPI enable input. Note this is active high.

Pin and Pad Layout

VBAT

ATEST

VEXT

X = 125.6, Y = 1640.2

X = 124.7, Y = 1139.8

X = 124.7, Y = 501.7

VSS

DIN

X = 2232.5, Y = 2135.7

X = 2233.4, Y = 1598.6

IC: X = 2358.0, Y = 2268.0

AS39513

AS39513 Datasheet(PDF) 4 Page - ams AG

AS39513 Datasheet(HTML) 4 Page - ams AG

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL