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NOTE ON USE

11) Instructions of pattern layouts

(1) The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance

(3) Please mount each external component as close to the IC as possible.

(4) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit

impedance.

(5) Make sure that the GND traces are as thick as possible, as variations in ground potential caused by high ground currents

at the time of switching may result in instability of the IC.

(6) Please note that internal driver transistors bring on heat because of the load current and ON resistance of High-side driver

transistor,

Low-side driver transistor.

< Reference Pattern Layout >

< Top view>

< Bottom side top view >

12) Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe

designs and post-aging protection treatment when using Torex products in their systems.

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About the appearance (coil part)

(1) Coils are compliant with general surface mount type chip coil (inductor) specifications and may have scratches,

flux contamination and the like.

(2) This product has a coil which is soldered on top of the package. There is no problem with normal board mounting reflow.

If the excessive shock is provided during reflow, there is a possibility to cause the coil misaligned or have the coil fell off.

Please be careful not to provide excessive shock to the PCB during the board mounting reflow.