1

2

3

6

5

4

GND PLANE

12

TLV758P

SBVS351 – APRIL 2018

www.ti.com

Product Folder Links: TLV758P

Submit Documentation Feedback

Copyright © 2018, Texas Instruments Incorporated

9 Power Supply Recommendations

Connect a low output impedance power supply directly to the IN pin of the TLV758P.

10 Layout

10.1 Layout Guidelines

•

Place input and output capacitors as close to the device as possible.

•

Use copper planes for device connections, in order to optimize thermal performance.

•

Place thermal vias around the device to distribute the heat.

•

Do not place a thermal via directly beneath the thermal pad of the DRV package. A via can wick solder or

solder paste away from the thermal pad joint during the soldering process, leading to a compromised solder

joint on the thermal pad.

10.2 Layout Example

Figure 4. DRV Package Layout Example