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LTC2480CDD Datasheet(PDF) 20 Page - Linear Technology |
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LTC2480CDD Datasheet(HTML) 20 Page - Linear Technology |
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20 / 40 page ![]() 20 LTC2480 2480f temperature dependent offset error due to the input leakage current. A 1nA input leakage current will develop a 1ppm offset error on a 5k resistor if VREF = 5V. This error has a very strong temperature dependency. SERIAL INTERFACE TIMING MODES The LTC2480’s 4-wire interface is SPI and MICROWIRE compatible. This interface offers several flexible modes of operation. These include internal/external serial clock, 3- or 4-wire I/O, single cycle or continuous conversion. The following sections describe each of these serial inter- face timing modes in detail. In all these cases, the con- verter can use the internal oscillator (FO = LOW or FO = HIGH) or an external oscillator connected to the FO pin. Refer to Table 6 for a summary. External Serial Clock, Single Cycle Operation (SPI/MICROWIRE Compatible) This timing mode uses an external serial clock to shift out the conversion result and a CS signal to monitor and control the state of the conversion cycle, see Figure 5. The serial clock mode is selected on the falling edge of CS. To select the external serial clock mode, the serial clock pin (SCK) must be LOW during each CS falling edge. The serial data output pin (SDO) is Hi-Z as long as CS is HIGH. At any time during the conversion cycle, CS may be pulled LOW in order to monitor the state of the converter. While CS is pulled LOW, EOC is output to the SDO pin. EOC = 1 while a conversion is in progress and EOC = 0 if the device is in the sleep state. Independent of CS, the device automatically enters the low power sleep state once the conversion is complete. When the device is in the sleep state, its conversion result is held in an internal static shift register. The device remains in the sleep state until the first rising edge of SCK is seen while CS is LOW. The input data is then shifted in via the SDI pin on the rising edge of SCK (including the first rising edge) and the output data is shifted out of the SDO pin on each falling edge of SCK. This enables external circuitry to latch the output on the rising edge of SCK. EOC can be latched on the first rising edge of SCK and the last bit of the conversion result can be latched on the 24th rising edge of SCK. On the 24th falling edge of SCK, the device begins a new conversion. SDO goes HIGH (EOC = 1) indicating a conversion is in progress. In applications where the processor generates 32 clock cycles, or to remain compatible with higher resolution converters, the LTC2480’s digital interface will ignore extra clock edges seen during the next conversion period after the 24th and outputs “1” for the extra clock cycles. At the conclusion of the data cycle, CS may remain LOW and EOC monitored as an end-of-conversion interrupt. Alternatively, CS may be driven HIGH setting SDO to Hi-Z. As described above, CS may be pulled LOW at any time in order to monitor the conversion status. Typically, CS remains LOW during the data output state. However, the data output state may be aborted by pulling CS HIGH anytime between the first rising edge and the 24th falling edge of SCK (see Figure 6). On the rising edge of CS, the device aborts the data output state and immediately initiates a new conversion. If the device has not finished loading the last input bit SPD of SDI by the time CS is pulled HIGH, the SDI information is discarded and the previous configuration is kept. This is useful for systems not requir- ing all 24 bits of output data, aborting an invalid conversion cycle or synchronizing the start of a conversion. APPLICATIO S I FOR ATIO Table 6. LTC2480 Interface Timing Modes CONVERSION DATA CONNECTION SCK CYCLE OUTPUT and CONFIGURATION SOURCE CONTROL CONTROL WAVEFORMS External SCK, Single Cycle Conversion External CS and SCK CS and SCK Figures 5, 6 External SCK, 3-Wire I/O External SCK SCK Figure 7 Internal SCK, Single Cycle Conversion Internal CS ↓ CS ↓ Figures 8, 9 Internal SCK, 3-Wire I/O, Continuous Conversion Internal Continuous Internal Figure 10 |
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