AL5890

Document number: DS40280 Rev. 2 - 2

10 of 17

www.diodes.com

May 2018

© Diodes Incorporated

AL5890

Thermal Fold-back Protection (TFP)

The AL5890 has a thermal fold-back protection (TFP) function and adopts self-adaptive control method, which can prevent the system from

breaking down caused by high temperature. The typical overheating temperature is set at +130°C, when the junction temperature of the IC is

higher than +130°C, the device will linearly decrease the internal reference voltage to decrease the output current. As a result of this feature, the

device can control the system’s output power at high ambient temperature, to control the quantity of heat of the system. This enhances the

safety of the system at high temperature.

Thermal fold-back waveform AL5890-10mA (PowerDI123 (Type B) package

shown as below:

Figure 19. Thermal Foldback Characteristic

Figure 20. Thermal Foldback Characteristic with Different Current Option across Temperature