FC8130 datasheet(12/16 Pages) FS

12 / 16 page

2015. 4. 23

12/16

Revision No : 0

FC8130

Power Dissipation

Thermal overload results from excessive power dissipation that causes the IC junction temperature to increase

beyond a safe operating level. The concept of thermal resistance θJA (°C/W) is often used to describe an IC

junction’s relative readiness in allowing its thermal energy to dissipate to its ambient air. An IC junction with a

low thermal resistance is preferred because it is relatively effective in dissipating its thermal energy to its

ambient, thus resulting in a relatively low and desirable junction temperature. The relationship between θJA and

TJ is as follows:

TJ = θJA x (PD) + TA

TA is the ambient temperature, and PD is the power generated by the IC and can be written as:

PD = IOUT(VIN -VOUT)

As the above equations show, it is desirable to work with ICs whose θJA values are small such that TJ does not

increase strongly with PD. To avoid thermally overloading the EMP8130, refrain from exceeding the absolute

maximum junction temperature rating of 150°C under continuous operating conditions. Overstressing the

regulator with high loading currents and elevated input-to-output differential voltages can increase the IC die

temperature significantly.

Shutdown

The FC8130 enters sleep mode when the EN pin is low. When this occurs, the pass transistor, the error amplifier,

and the biasing circuits, including the bandgap reference, are turned off, thus reducing the supply current to

typically < 1uA. The low supply current makes the FC8130 best suited for battery-powered applications. The

maximum guaranteed voltage at the EN pin to enter sleep mode is 0.4V. A minimum guaranteed voltage of

1.0V at the EN pin will activate the FC8130. To constantly keep the regulator on, direct connection of the EN

pin to the VIN pin is allowed.

FC8130 Datasheet(PDF) 12 Page - First Silicon Co., Ltd