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TUSB216 Datasheet(PDF) 5 Page - Texas Instruments |
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TUSB216 Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 33 page ![]() 5 TUSB216 www.ti.com SLLSEZ6A – FEBRUARY 2019 – REVISED DECEMBER 2019 Product Folder Links: TUSB216 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage range VCC –0.3 7 V Voltage range USB data DxP, DxM –0.3 5.5 V Voltage range on BOOST pin BOOST -0.3 1.98 V Voltage range other pins RX_SEN,CDP_ENZ,SCL, RSTN -0.3 5.5 V Storage temperature, Tstg –65 150 °C Maximum junction temperature, TJ (max) 125 °C 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101 ±750 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCC Supply voltage 2.3 5 6.5 V TA Operating free-air temperature (Standard) 0 70 °C TJ Junction temperature (Standard) 85 °C VI2C_BUS I2C Bus Voltage 1.62 3.6 V DxP, DxM Voltage range USB data 0 3.6 V BOOST Voltage range BOOST pin 0 1.98 V Digital Voltage range other pins (SCL, SDA, RX_SEN, CDP_ENZ, RSTN) 0 3.6 V (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC (1) RGY (VQFN) UNIT 14 PINS RθJA Junction-to-ambient thermal resistance 49.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 52.8 °C/W RθJB Junction-to-board thermal resistance 24.2 °C/W ψJT Junction-to-top characterization parameter 2.2 °C/W ψJB Junction-to-board characterization parameter 24.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 7 °C/W (1) All typical values are at VCC = 5 V, and TA = 25°C. 6.5 Electrical Characteristics Over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT POWER IACTIVE_HS High Speed Active Current USB channel = HS mode. 480 Mbps traffic. VCC supply stable, with Boost = Max 22 36 mA IIDLE_HS High Speed Idle Current USB channel = HS mode, no traffic. VCC supply stable, Boost = Max 22 36 mA |
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