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X96012 Datasheet(PDF) 4 Page - Intersil Corporation |
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X96012 Datasheet(HTML) 4 Page - Intersil Corporation |
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4 / 27 page ![]() 4 FN8216.0 March 10, 2005 ABSOLUTE MAXIMUM RATINGS All voltages are referred to Vss. Temperature under bias ................... -65°C to +100°C Storage temperature ........................ -65°C to +150°C Voltage on every pin except Vcc ................ -1.0V to +7V Voltage on Vcc Pin .............................................0 to 5.5V D.C. Output Current at pin SDA ...................... 0 to 5 mA D.C. Output Current at pins R1, R2, VRef and VSense.................................... -0.50 to 1 mA D.C. Output Current at pins I1 and I2 ....... -3.5 to +3.5mA Lead temperature (soldering, 10 seconds) ........ 300°C COMMENT Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional operation of the device (at these or any other conditions above those listed in the operational sections of this specification) is not implied. Exposure to absolute maximum rating con- ditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS . Parameter Min. Max. Units Temperature -40 +100 °C Temperature while writing to memory 0 +70 °C Voltage on Vcc Pin 35.5 V Voltage on any other Pin -0.3 Vcc + 0.3 V ELECTRICAL CHARACTERISTICS (Conditions are as follows, unless otherwise specified) All typical values are for 25°C ambient temperature and 5 V at pin Vcc. Maximum and minimum specifications are over the recommended operating conditions. All voltages are referred to the voltage at pin Vss. All bits in control reg- isters are “0”. 255 Ω, 0.1%, resistor connected between R1 and Vss, and another between R2 and Vss. 400kHz TTL input at SCL. SDA pulled to Vcc through an external 2k Ω resistor. 2-wire interface in “standby” (see notes 1 and 2 on page 5). WP, A0, A1, and A2 floating. VRef pin unloaded Symbol Parameter Min Typ Max Unit Test Conditions / Notes Iccstby Standby current into Vcc pin 2 mA R1 and R2 floating, VRef unload- ed. Iccfull Full operation current into Vcc pin 15 mA 2-wire interface reading from memory, I1 and I2 both connected to Vss, DAC input bytes: FFh, VRef unloaded. Iccwrite Nonvolatile Write current into Vcc pin 4 mA Average from START condition until tWP after the STOP condition WP: Vcc, R1 and R2 floating, VRef unloaded. IPLDN On-chip pull down current at WP, A0, A1, and A2 01 20 µAV(WP), V(A0), V(A1), and V(A2) from 0V to Vcc VILTTL SCL and SDA, input Low voltage 0.8 V VIHTTL SCL and SDA, input High voltage 2.0 V IINTTL SCL and SDA input current -1 10 µA Pin voltage between 0 and Vcc, and SDA as an input. VOLSDA SDA output Low voltage 0 0.4 V I(SDA) = 2 mA IOHSDA SDA output High current 0 100 µAV(SDA) = Vcc VILCMOS WP, A0, A1, and A2 input Low voltage 00.2 x Vcc V VIHCMOS WP, A0, A1, and A2 input High voltage 0.8 x Vcc Vcc V X96012 |
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