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TLV9352IDDFR Datasheet(PDF) 7 Page - Texas Instruments

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Part # TLV9352IDDFR
Description  TLV935x 3.5-MHz, 40-V, RRO, MUX-Friendly Operational Amplifier for Cost-Sensitive Systems
PDF  52 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLV9352IDDFR Datasheet(HTML) 7 Page - Texas Instruments

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6.5 Thermal Information for Dual Channel
THERMAL METRIC (1)
TLV9352
UNIT
D
(SOIC)
DDF
(SOT-23-8)
DGK (2)
(VSSOP)
PW
(TSSOP)
8 PINS
8 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
138.7
143.5
TBD
185.1
°C/W
RθJC(top)
Junction-to-case (top) thermal
resistance
78.7
79.9
TBD
74.0
°C/W
RθJB
Junction-to-board thermal resistance
82.2
61.6
TBD
115.7
°C/W
ψJT
Junction-to-top characterization
parameter
27.8
5.7
TBD
12.3
°C/W
ψJB
Junction-to-board characterization
parameter
81.4
61.3
TBD
114.0
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal
resistance
N/A
N/A
TBD
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2)
This package option is preview for TLV9352.
6.6 Thermal Information for Quad Channel
THERMAL METRIC (1)
TLV9354
UNIT
D (2)
(SOIC)
PW (2)
(TSSOP)
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
TBD
TBD
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
TBD
TBD
°C/W
RθJB
Junction-to-board thermal resistance
TBD
TBD
°C/W
ψJT
Junction-to-top characterization parameter
TBD
TBD
°C/W
ψJB
Junction-to-board characterization parameter
TBD
TBD
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
TBD
TBD
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2)
This package option is preview for TLV9354.
www.ti.com
TLV9352
SBOS994B – NOVEMBER 2019 – REVISED AUGUST 2020
Copyright © 2020 Texas Instruments Incorporated
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Product Folder Links: TLV9352



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