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TLV9352IDDFR Datasheet(PDF) 25 Page - Texas Instruments

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Part # TLV9352IDDFR
Description  TLV935x 3.5-MHz, 40-V, RRO, MUX-Friendly Operational Amplifier for Cost-Sensitive Systems
PDF  52 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLV9352IDDFR Datasheet(HTML) 25 Page - Texas Instruments

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7.3.7 Electrical Overstress
Designers often ask questions about the capability of an operational amplifier to withstand electrical overstress
(EOS). These questions tend to focus on the device inputs, but may involve the supply voltage pins or even the
output pin. Each of these different pin functions have electrical stress limits determined by the voltage
breakdown characteristics of the particular semiconductor fabrication process and specific circuits connected to
the pin. Additionally, internal electrostatic discharge (ESD) protection is built into these circuits to protect them
from accidental ESD events both before and during product assembly.
Having a good understanding of this basic ESD circuitry and its relevance to an electrical overstress event is
helpful. Figure 7-8 shows an illustration of the ESD circuits contained in the TLV935x (indicated by the dashed
line area). The ESD protection circuitry involves several current-steering diodes connected from the input and
output pins and routed back to the internal power-supply lines, where the diodes meet at an absorption device or
the power-supply ESD cell, internal to the operational amplifier. This protection circuitry is intended to remain
inactive during normal circuit operation.
Power Supply
ESD Cell
100
100
VSS
VDD
IN–
IN+
+
–
R1
RS
RF
TVS
TVS
RL
VIN
+VS
–VS
TLV935x
ID
+
–
Figure 7-8. Equivalent Internal ESD Circuitry Relative to a Typical Circuit Application
An ESD event is very short in duration and very high voltage (for example, 1 kV, 100 ns), whereas an EOS event
is long duration and lower voltage (for example, 50 V, 100 ms). The ESD diodes are designed for out-of-circuit
ESD protection (that is, during assembly, test, and storage of the device before being soldered to the PCB).
During an ESD event, the ESD signal is passed through the ESD steering diodes to an absorption circuit
(labeled ESD power-supply circuit). The ESD absorption circuit clamps the supplies to a safe level.
Although this behavior is necessary for out-of-circuit protection, excessive current and damage is caused if
activated in-circuit. A transient voltage suppressors (TVS) can be used to prevent against damage caused by
turning on the ESD absorption circuit during an in-circuit ESD event. Using the appropriate current limiting
resistors and TVS diodes allows for the use of device ESD diodes to protect against EOS events.
www.ti.com
TLV9352
SBOS994B – NOVEMBER 2019 – REVISED AUGUST 2020
Copyright © 2020 Texas Instruments Incorporated
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