MPC755 datasheet(47/56 Pages) NXP

47 / 56 page

MPC755 RISC Microprocessor Hardware Specifications, Rev. 8

Freescale Semiconductor

System Design Information

Figure 27. Thermal Performance of Select Thermal Interface Materials

The board designer can choose between several types of thermal interface. Heat sink adhesive materials

should be selected based on high conductivity, yet adequate mechanical strength to meet equipment

shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive

materials provided by the following vendors:

The Bergquist Company

800-347-4572

18930 West 78th St.

Chanhassen, MN 55317

Internet: www.bergquistcompany.com

Chomerics, Inc.

781-935-4850

77 Dragon Ct.

Woburn, MA 01888-4014

Internet: www.chomerics.com

Dow-Corning Corporation

800-248-2481

Dow-Corning Electronic Materials

2200 W. Salzburg Rd.

Midland, MI 48686-0997

Internet: www.dow.com

0.5

1.5

304050

607080

Silicone Sheet (0.006 in.)

Bare Joint

Floroether Oil Sheet (0.007 in.)

Graphite/Oil Sheet (0.005 in.)

Synthetic Grease

Contact Pressure (psi)

MPC755 Datasheet(PDF) 47 Page - NXP Semiconductors