(All voltages referenced to GND.)

IN (Note 1), OUT, EN, EN .......................................-0.3V to +6V

POK............................................. -0.3V to max (IN,OUT) + 0.3V

Maximum Current into IN (DC) (Note 2) ..............................4.5A

Peak Current into IN (10ms) ...................................................8A

WLP (derate 11.9mW/°C above +70°C)......................952mW

Operating Temperature Range........................... -40°C to +85°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Soldering Temperature (reflow).......................................+260°C

WLP

(Note 3)

noted.) (Note 4)

Electrical Characteristics

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

IN, OUT

Input Voltage Range

2.1

5.5

V

Supply Current

13

30

µA

IN Shutdown Current

Device disabled,

2

6

µA

OUT Shutdown Current

Device disabled,

2

6

µA

OVP

On-Resistance (IN to OUT)

15

22

mΩ

Overvoltage Trip-Level Threshold

MAX14736

4.600

4.700

4.800

V

MAX14737

5.095

5.200

5.305

V

Overvoltage Trip-Level Hysteresis

100

mV

Undervoltage Trip-Level Threshold

2.015

V

Undervoltage Trip-Level Hysteresis

80

mV

OUT Load Capacitance

100

µF

DIGITAL OUTPUT (POK)

Output Voltage Low

0.4

V

Output Voltage High

1.4

V

MAX14736/MAX14737

Precision, Ultra-Fast, Low Supply Current,

Bidirectional Overvoltage Protector

www.maximintegrated.com

Maxim Integrated │ 2

Note 1: Survives burst pulse up to ±40V with 2Ω minimum source resistance.

Note 2: Limited by thermal design.

Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics