AT25SL321 datasheet(75/82 Pages) DIALOG

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AT25SL321

DS-25SL321–112H–2020-10

10.

Ordering Information

10.1 Ordering Code Detail

AT 2 5 S

3 2

1–

–

Designator

Product Family

Device Density

321 = 32-megabit

Package Option

M = 8-pad, 5 x 6 x 0.6 mm UDFN

MB = 8-pad, 3 x 4 x 0.55 mm USON

S = 8-lead, 208-mil wide SOIC

SS = 8-lead, 150-mil SOIC

U = 8-ball 0.5 mm pitch dBGA

Device Grade

U = Green, Matte Sn or Sn alloy,

Industrial temperature range

(–40 °C to + 85 °C)

H = NiPdAu lead-frame

Industrial Temp range (-40 °C + 85 °C)

Shipping Carrier Option

T = Tape and reel

Operating Voltage

E = 1.7 V to 2.0 V

Ordering Code (1)

Package

Lead Finish

Operating

Voltage

Max. Freq.

(MHz)

Operation Range

AT25SL321-MHE-T

8MA1

NiPdAu

1.7 V - 2.0 V

104 MHz (2)

-40

℃ to 85 ℃

(Industrial

Temperature Range)

AT25SL321-SSHE-T

8S1

AT25SL321-MBUE-T

8MA2

AT25SL321-SUE-T

8S4

SnAgCu

AT25SL321-UUE-T (3)

8-WLCSP

1. The shipping carrier option code is not marked on the devices.

2. Contact Adesto for availability of 133 MHz operating frequency.

3. Contact Adesto for mechanical drawing or sales information.

Package Type

8S4

8-lead, 0.208" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)

8S1

8-lead, 150-mil narrow body JEDEC SOIC

8MA1

8-pad (5 x 6 x 0.6 mm body), Thermally Enhanced Plastic Ultra-Thin Dual Flat No-lead (UDFN)

8MA2

8-pad (3 x 4 x 0.55 mm body), Thermally Enhanced Plastic Ultra-Thin Small Outline No-lead (USON)

8-WLCSP

8-ball, 0.5mm pitch, die Ball Grid Array (dBGA)

AT25SL321 Datasheet(PDF) 75 Page - Dialog Semiconductor

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