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DA14683 Datasheet(PDF) 21 Page - Dialog Semiconductor

Part # DA14683
Description  Bluetooth Low Energy 5.0 SoC with Enhanced Security
PDF  469 Pages
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Manufacturer  DIALOG [Dialog Semiconductor]
Direct Link  http://www.dialog-semiconductor.com/
Logo DIALOG - Dialog Semiconductor

DA14683 Datasheet(HTML) 21 Page - Dialog Semiconductor

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Datasheet
Revision 3.4
24-Nov-2020
CFR0011-120-01
21 of 469
© 2019-2020 Dialog Semiconductor
DA14683
Bluetooth Low Energy 5.0 SoC with Enhanced Security
FINAL
Table 6: OTP header details
Address
Size (B)
Field name
Description
0x30084000
184
Chip Configuration Section (CCS)
0x7F8E9C0
8
Mirrored/Cached At startup
0: Mirrored
1: Cached
0x7F8E9C8
8
Non-Volatile Memory
0: FLASH
Anything else: OTP
0x7F8E9D0
8
Product Ready
0x00: OTP or FLASH not programmed
0xAA: OTP or FLASH programmed
0x7F8E9D8
8
Redundancy
0xAA: No redundancy used
Anything else: Redundancy active
0x7F8E9E0
8
Reserved
Reserved
0x7F8E9E8
8
Shuffle RAMs
Defines the sequence of the RAM cells in a continu-
ous memory space
0x0: DataRAM1, DataRAM2, DataRAM3
0x1: DataRAM2, DataRAM1, DataRAM3
0x2: DataRAM3, DataRAM1, DataRAM2
0x3: DataRAM3, DataRAM2, DataRAM1
DataRAM1=8KB, DataRAM2=24KB,
DataRAM3=32KB"
0x7F8E9F0
8
JTAG
0x0: Enabled
0x1: Disabled
0x7F8E9F8
8
Sleep Clock
0x0: XTAL32
0x1: RCX
0x7F8EA00
8
Position/Package
B7-B4: Reserved. Keep these values to 0
B3:
0x00 – WLCSP
0x55 – aQFN60(DA14681/DA15101)
0x99 – KGD
B2: Wafer number
B1: Y coord,
B0: X coord.
0x7F8EA08
8
Tester/Timestamp1
B7: Reserved
B6: Tester ID (MSByte)
B5: Tester ID (LSByte)
B4: Tester Site
B3: TimeStamp Byte 3
B2: TimeStamp Byte 2
B1: TimeStamp Byte 1
B0: TimeStamp Byte 0
0x7F8EA10
8
Mirror Image Length
Contains the size of the image to be mirrored
(unit: 32-bit words)
0x7F8EA18
8
Reserved
0x7F8EA20
8
Chip ID
ASCII code for “14683“



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