AXL F DI32/1 1F

8020_en_03

PHOENIX CONTACT

2

2Table of contents

1

Description .............................................................................................................................. 1

2

Table of contents ..................................................................................................................... 2

3

Ordering data .......................................................................................................................... 3

4

Technical data ......................................................................................................................... 3

5

Internal circuit diagram ............................................................................................................ 6

6

Terminal point assignment....................................................................................................... 6

7

Connection example................................................................................................................ 6

8

Local status and diagnostic indicators ..................................................................................... 7

9

Process data............................................................................................................................ 8

10

Parameter, diagnostics and information (PDI) ......................................................................... 8

11

Standard objects ..................................................................................................................... 9

11.1

Objects for identification (device rating plate)

.............................................................................. 9

11.2

Object for multilingual capacity

.............................................................................................. 10

11.3

Diagnostics objects

............................................................................................................ 10

11.4

Objects for process data management

.................................................................................... 11

12

Application objects ................................................................................................................ 11

13

Device descriptions ............................................................................................................... 11