7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Input voltage

–0.3

6

V

Output voltage

–0.3

6

V

Enable voltage

–0.3

6

V

QOD pin voltage

–0.3

6

V

Maximum continuous switch current

2

A

Maximum pulsed switch current, pulse < 300-µs, 2% duty cycle

2.5

A

Maximum junction temperature

125

°C

Storage temperature

–65

150

°C

Maximum Lead temperature (10-s soldering time)

300

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions. Pins listed as ±500 V may actually have higher performance.

7.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage

1

5.5

V

Output voltage

0

5.5

V

High-level input voltage, ON

1

5.5

V

Low-level input voltage, ON

0

0.35

V

QOD Pin Voltage

0

5.5

V

Timing Capacitor Voltage Rating

7

V

7.4 Thermal Information

Thermal Parameters(1)

TPS22917

UNIT

DBV (SOT-23)

6 PINS

Junction-to-ambient thermal resistance

183

°C/W

Junction-to-case (top) thermal resistance

152

°C/W

Junction-to-board thermal resistance

34

°C/W

Junction-to-top characterization parameter

37

°C/W

Junction-to-board characterization parameter

33

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

TPS22917

SLVSDW8B – SEPTEMBER 2017 – REVISED DECEMBER 2021

Copyright © 2021 Texas Instruments Incorporated

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