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F2910 Datasheet

August 31, 2020

Absolute Maximum Ratings

Stresses beyond those listed below may cause permanent damage to the device. Functional operation of the device at these or any other

conditions beyond those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Symbol

Minimum

Maximum

Units

VDD to GND

VDD

-0.3

+6.0

V1 to GND

VLogic

-0.3

Lower of

(VDD + 0.3V, 3.6V)

RF1, RF2 to GND

VRF

-0.3

+0.3

RF Input Power Port 1 or 2. Other port terminated into 50 Ω [a]

PRF12

dBm

RF Input Power Port 1 in isolation. Port 2 terminated into 50 Ω [a]

PRF1_ISO

RF Input Power Port 2 in isolation. Port 1 terminated into 50 Ω [a]

PRF2_ISO

Maximum Junction Temperature

Tjmax

+140

°C

Storage Temperature Range

TST

-65

+150

°C

Lead Temperature (soldering, 10s)

TLEAD

+260

°C

ElectroStatic Discharge – HBM

(JEDEC/ESDA JS-001-2012)

VESDHBM

2000

(Class 2)

ElectroStatic Discharge – CDM

(JEDEC 22-C101F)

VESDCDM

1000

(Class C3)

a. VDD = 2.7 V to 5.5 V, 30 MHz ≤ FRF ≤ 8000 MHz, Tc = 105°C, ZS = ZL = 50 ohms.

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