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OPA2675RGVR Datasheet(PDF) 4 Page - Texas Instruments |
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OPA2675RGVR Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 39 page ![]() 6 Pin Configuration and Functions NC (1) -INA +INA GND NC (1) -INB +INB A1 1 2 3 4 12 11 10 9 Figure 6-1. RGV Package, 16-Pin VQFN (Top View) Figure 6-2. RGV Package, 16-Pin VQFN (Bottom View) Table 6-1. Pin Functions PIN TYPE(2) DESCRIPTION NAME NO. A0 8 I Bias Mode Control A1 9 I Bias Mode Control GND 4 P Ground –IN A 2 I Amplifier A inverting input +IN A 3 I Amplifier A noninverting input –IN B 11 I Amplifier B inverting input +IN B 10 I Amplifier B noninverting input NC(1) 1, 5, 6, 12, 15 — Do not connect. OUT A 16 O Amplifier A output OUT B 13 O Amplifier B output –VS 7 P Negative power-supply connection +VS 14 P Positive power-supply connection Thermal Pad — Electrically connected to die substrate and VS–. Connect to VS– on the PCB for best performance. (1) There is no internal connection. Typically GND is the recommended connection to a heat spreading plane. (2) I = input, O = output, P = power, GND = ground, NC = no connect. OPA2675 SBOSAA5B – APRIL 2022 – REVISED SEPTEMBER 2022 www.ti.com 4 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: OPA2675 |
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