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HC5503 Datasheet(PDF) 1 Page - Renesas Technology Corp

Part # HC5503
Description  Low Cost 24V SLIC For PABX/Key Systems
PDF  17 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

HC5503 Datasheet(HTML) 1 Page - Renesas Technology Corp

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FN4344 Rev 5.00
Page 1 of 17
June 2004
FN4344
Rev 5.00
June 2004
HC5503
Low Cost 24V SLIC For PABX/Key Systems
DATASHEET
The Intersil HC5503 low cost SLIC is optimized for use in
small Analog or mixed Analog and Digital Key Telephone
Systems (KTS) or PBX products. The low component count
solution and surface mount package options, enable a small
desktop Key System/PBX product to be achieved. The
internal power dissipation of the end product is minimized by
the low power consumption and minimal power supply
voltage requirements of the HC5503.
The HC5503 integrated solution provides higher quality,
higher reliability and better performance solution than a
transformer, thick film hybrid or discrete analog subscriber
interface design.
The HC5503 is designed in a Dielectrically isolated bipolar
technology and is inherently latch proof and does not require
hot plug or power supply sequencing precautions.
Features
• Wide Operating Battery Range (-21V to -44V)
• Single Additional +5V Supply
• 25mA Short Loop Current Limit
• Ring Relay Driver
• Switch Hook and Ring Trip Detect
• Low On-Hook Power Consumption
• On-Hook Transmission
• ITU-T Longitudinal Balance Performance
• Loop Power Denial Function
• Thermal Protection
• Supports Tip, Ring or Balanced Ringing Schemes
• Low Profile Surface Mount Packaging
• Pin Compatible with Industry Standard HC5504B SLIC
• Pb-free Available
Applications
• Analog Subscriber Line Interfaces in Analog Key Systems
and Digital ISDN PABX Systems
• Related Literature
- AN571, Using Ring Sync with HC-5502A and HC-5504
SLICs
Ordering Information
PART NUMBER
TEMP.
RANGE (°C)
PACKAGE
PKG.
DWG. #
HC5503CB
0 to 75
24 Ld SOIC
M24.3
HC5503CBZ (Note)
0 to 75
24 Ld SOIC (Pb-free) M24.3
HC5503CBZ96
(Note)
0 to 75
24 Ld SOIC (Pb-free) M24.3
NOTE: Intersil Pb-free products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which is compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J Std-020B.
NOT RECOMMENDED FO
R NEW DESIGNS
RECOMMENDED REPLA
CEMENT PART
HC5503PRC


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