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NVT2002GD Datasheet(PDF) 31 Page - NXP Semiconductors

Part # NVT2002GD
Description  Bidirectional voltage level translator for open-drain and push-pull applications
PDF  32 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

NVT2002GD Datasheet(HTML) 31 Page - NXP Semiconductors

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NXP Semiconductors
NVT2001; NVT2002
Bidirectional voltage level translator for open-drain and push-pull applications
Tables
Tab. 1.
Ordering information ..........................................2
Tab. 2.
Ordering options ................................................2
Tab. 3.
Pin description ...................................................4
Tab. 4.
Function selection (example) ............................ 4
Tab. 5.
Application operating conditions ........................5
Tab. 6.
Pull-up resistor minimum values, 3 mA
driver sink current for PCA9306 and
NVT20xx ............................................................7
Tab. 7.
Pull-up resistor minimum values, 10 mA
driver sink current for PCA9306 and
NVT20xx ............................................................8
Tab. 8.
Pull-up resistor minimum values, 15 mA
driver sink current for PCA9306 and
NVT20xx ............................................................8
Tab. 9.
Limiting values ................................................ 10
Tab. 10. Operating conditions ....................................... 10
Tab. 11. Static characteristics ....................................... 11
Tab. 12. Dynamic characteristics for open-drain
drivers ..............................................................12
Tab. 13. SnPb eutectic process (from J-STD-020D) ..... 21
Tab. 14. Lead-free process (from J-STD-020D) ............21
Tab. 15. Abbreviations ...................................................28
Tab. 16. Revision history ...............................................28
Figures
Fig. 1.
Logic diagram of NVT2001; NVT2002
(positive logic) ................................................... 3
Fig. 2.
Pin configuration for XSON6 .............................3
Fig. 3.
Pin configuration for TSSOP8 ...........................3
Fig. 4.
Pin configuration for XSON8U .......................... 3
Fig. 5.
Pin configuration SOT1052-2 (HXSON8) .......... 4
Fig. 6.
Typical application circuit (switch always
enabled) .............................................................5
Fig. 7.
Typical application circuit (switch enable
control) ...............................................................6
Fig. 8.
Bidirectional translation to multiple higher
voltage levels .................................................... 6
Fig. 9.
An example waveform for maximum
frequency ...........................................................9
Fig. 10.
Typical ON-state resistance versus ambient
temperature ..................................................... 12
Fig. 11.
AC test setup .................................................. 13
Fig. 12.
Example of typical AC waveform .................... 13
Fig. 13.
Load circuit for outputs ....................................13
Fig. 14.
Typical capacitance versus propagation
delay ................................................................14
Fig. 15.
Package outline SOT886 (XSON6) .................15
Fig. 16.
Package outline SOT505-1 (TSSOP8) ............16
Fig. 17.
Package outline SOT996-2 (XSON8U) ........... 17
Fig. 18.
Package outline SOT1052-2 (HXSON8) ......... 18
Fig. 19.
Package outline SOT1052-2 (HXSON8) ......... 19
Fig. 20.
Temperature profiles for large and small
components .....................................................21
Fig. 21.
PCB footprint for SOT886 (XSON6); reflow
soldering ..........................................................22
Fig. 22.
PCB footprint for SOT505-1 (TSSOP8);
reflow soldering ............................................... 22
Fig. 23.
PCB footprint for SOT996-2 (XSON8U);
reflow soldering ............................................... 23
Fig. 24.
PCB footprint for SOT1052-2 (HXSON8);
recommended solder mask opening pattern ... 24
Fig. 25.
PCB footprint for SOT1052-2 (HXSON8);
recommended I/O pads and solderable
area ................................................................. 25
Fig. 26.
PCB footprint for SOT1052-2 (HXSON8);
recommended solder paste stencil ..................26
Fig. 27.
PCB footprint for SOT1052-2 (HXSON8);
notes ................................................................27
NVT2001_NVT2002
All information provided in this document is subject to legal disclaimers.
© 2023 NXP B.V. All rights reserved.
Product data sheet
Rev. 4.4 — 22 May 2023
31 / 32



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