NXP Semiconductors

NVT2001; NVT2002

Bidirectional voltage level translator for open-drain and push-pull applications

7.5 GD package vs TL package

Due to differences in package construction the TL package has a center pad vs no center pad for the GD

package. The following section provides guidance in replacement vs new applications.

• No trace under GD package

1. Replacement of GD package: The pad is not electrically connected to the silicon (no wire bond and epoxy

is not conductive) and can be left floating. It is not required to be connected to the PCB. Simply place the

TL package on the same PCB traces as the existing GD package.

2. New use of the TL package: Place PCB trace for soldering of the center pad based on PCB layout

recommendations for better mechanical connection and thermal conductivity. The PCB center pad can be

connect to GND or left floating.

• Trace under the GD package

1. Replacement of GD package: It is not best practice to have center pad over the trace but since the TL

package center pad is not connected to the silicon the risk is low. If there are multiple traces there could

be EMI and cross talk. In both cases the customer needs to evaluate risk.

2. New use of the TL package: Do not route traces under the package

8 Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Over operating free-air temperature range.

Symbol

Parameter

Conditions

Min

Max

Unit

Vref(A)

reference voltage (A)

-0.5

+6

V

Vref(B)

reference voltage (B)

-0.5

+6

V

VI

input voltage

-0.5[1]

+6

V

VI/O

voltage on an input/output pin

-0.5[1]

+6

V

Ich

channel current (DC)

-

128

mA

IIK

input clamping current

VI < 0 V

-50

-

mA

IOK

output clamping current

[2] -50

+50

mA

Tstg

storage temperature

-65

+150

°C

Table 9. Limiting values

[1]

The input and input/output negative voltage ratings may be exceeded if the input and input/output clamp current ratings are observed.

[2]

Low duty cycle pulses, not DC because of heating.

9 Recommended operating conditions

Symbol

Parameter

Conditions

Min

Max

Unit

VI/O

voltage on an input/output pin

An, Bn

0

5.5

V

Vref(A)

reference voltage (A)

VREFA

[1] 0

5.4

V

Vref(B)

reference voltage (B)

VREFB

[1] 0

5.5

V

VI(EN)

input voltage on pin EN

0

5.5

V

Isw(pass)

pass switch current

-

64

mA

Tamb

ambient temperature

operating in free-air

-40

+105

°C

Table 10. Operating conditions

NVT2001_NVT2002

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Product data sheet

Rev. 4.4 — 22 May 2023

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