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ADV7393 Datasheet(PDF) 15 Page - Analog Devices

Part # ADV7393
Description  Low Power, Chip Scale 10-Bit SD/HD Video Encoder
PDF  96 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADV7393 Datasheet(HTML) 15 Page - Analog Devices

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ADV7390/ADV7391/ADV7392/ADV7393
Rev. 0 | Page 15 of 96
ABSOLUTE MAXIMUM RATINGS
Table 10.
Parameter1
Rating
VAA to AGND
−0.3 V to +3.9 V
VDD to DGND
−0.3 V to +2.3 V
PVDD to PGND
−0.3 V to +2.3 V
VDD_IO to GND_IO
−0.3 V to +3.9 V
VAA to VDD
−0.3 V to +2.2 V
VDD to PVDD
−0.3 V to +0.3 V
VDD_IO to VDD
−0.3 V to +2.2 V
AGND to DGND
−0.3 V to +0.3 V
AGND to PGND
−0.3 V to +0.3 V
AGND to GND_IO
−0.3 V to +0.3 V
DGND to PGND
−0.3 V to +0.3 V
DGND to GND_IO
−0.3 V to +0.3 V
PGND to GND_IO
−0.3 V to +0.3 V
Digital Input Voltage to GND_IO
−0.3 V to VDD_IO + 0.3 V
Analog Outputs to AGND
−0.3 V to VAA
Storage Temperature Range (tS)
−60°C to +100°C
Junction Temperature (tJ)
150°C
Lead Temperature (Soldering, 10 sec)
260°C
1 Analog output short circuit to any power supply or common can be of an
indefinite duration.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 11. Thermal Resistance1
Package Type
θJA2
θJC
Unit
32-Lead LFCP
27
32
°C/W
40-Lead LFCSP
26
32
°C/W
1 Values are based on a JEDEC 4 layer test board.
2 With the exposed metal paddle on the underside of the LFCSP soldered to
the PCB ground.
The ADV739x is a Pb-free product. The lead finish is 100% pure
Sn electroplate. The device is RoHS compliant, suitable for Pb-
free applications up to 255°C (±5°C) IR reflow (JEDEC STD-20).
The ADV739x is backward-compatible with conventional SnPb
soldering processes. The electroplated Sn coating can be
soldered with SnPb solder pastes at conventional reflow
temperatures of 220°C to 235°C.
ESD CAUTION



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