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PACKAGE OUTLINE

4.1

3.9

5.1

4.9

1.0

0.8

0.05

0.00

2X 1.05

12X 0.6

0.4

12X 0.35

0.25

2X 1.0

0.8

2X 0.55

0.45

4X 0.525

6X 0.3

0.2

2X 2.1

.000 PKG

0

1.5

0.9

2X 0.3

2X 0.3

0.9

1.5

2X 2.1

(0.2) TYP

VQFN - 1 mm max height

REM0014B

PLASTIC QUAD FLATPACK - NO LEAD

4228722/A 05/2022

0.08 C

0.1

C A B

0.05

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

PIN 1 INDEX AREA

SEATING PLANE

PKG

1

6

7

8

13

14

SCALE 3.000

A

B

C

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INA741

SBOSAC2 – JULY 2023

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