NXP Semiconductors

BSS87

200 V, N-channel vertical D-MOS transistor

BSS87

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Product data sheet

9 December 2014

12 / 16

13. Soldering

solder lands

solder resist

occupied area

solder paste

sot089_fr

1.2

1.9

2

2.25

4.75

1

(3×)

0.7

(3×)

0.6

(3×)

1.1

(2×)

1.2

0.85

0.2

0.5

1.7

4.85

3.95

4.6

1.5

1.5

Dimensions in mm

Fig. 19. Reflow soldering footprint for SOT89

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot089_fw

0.7

5.3

6.6

2.4

3.5

0.5

1.8

(2×)

1.5

(2×)

7.6

1.9

1.9

Dimensions in mm

Fig. 20. Wave soldering footprint for SOT89