MP86998

– INTEGRATED INTELLI-PHASETM SOLUTION IN TLGA PACKAGE

MP86998 Rev. 1.0

www.MonolithicPower.com

4

11/3/2020

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ABSOLUTE MAXIMUM RATINGS (1)

Supply voltage (VIN) ..................................... 18V

VIN - VSW (DC) ..................................-0.3V to +25V

VIN - VSW (10ns)....................................-5V to +32V

VSW (DC) .................................. -0.3V to VIN + 0.3V

VSW (25ns)............................................-5V to +25V

VBST ...................................................... VSW + 4V

VBST - VPHASE ...................................-0.3V to +4V

VDD, VDRV .........................................-0.3V to +4V

All other pins ...................... -0.3V to VDD + 0.3V

Instantaneous current ............................... 125A

Junction temperature ................................150°C

Lead temperature .....................................260°C

Storage temperature ................ -65°C to +150°C

ESD Ratings

Human body model (HBM) ..................... 2000V

Charged device model (CDM)..................2000V

Recommended Operating Conditions (2)

Supply voltage (VIN) .........................3.0V to 16V

Driver voltage (VDRV) .................... 3.0V to 3.6V

Logic voltage (VDD)........................ 3.0V to 3.6V

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance (3)

θJB θJC_TOP

TLGA-41 (5mmx6mm) ......... 2.7..... 12.4... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The device is not guaranteed to function outside of its operating

conditions.

3)

θ

JB: Thermal resistance from the junction to the board around

the PGND soldering point.

θ

JC_TOP: Thermal resistance from the junction to the top of the

package.