UC1682
80x104RGB CSTN Controller-Driver
Revision 0.6
3
General Notes
APPLICATION INFORMATION
For improved readability, the specification contains many application data points. When application information is given, it
is advisory and does not form part of the specification for the device.
BARE DIE DISCLAIMER
All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of
ninety (90) days from the date of UltraChip’s delivery. There is no post waffle saw/pack testing performed on individual die.
Although the latest processes are utilized for wafer sawing and die pick-&-place into waffle pack carriers, UltraChip has no
control of third party procedures in the handling, packing or assembly of the die. Accordingly, it is the responsibility of the
customer to test and qualify their applications in which the die is to be used. UltraChip assumes no liability for device
functionality or performance of the die or systems after handling, packing or assembly of the die.
OTP CELL LIGHT SENSITIVITY
The OTP memory cell is sensitive to photon excitation. Under extended exposure to strong ambient light, the OTP cells
can lose its content before the specified memory retention time span. The system designer is advised to provide proper
light shields to realize full OTP content retention performance.
LIFE SUPPORT APPLICATIONS
These devices are not designed for use in life support appliances, or systems where malfunction of these products can
reasonably be expected to result in personal injuries. Customer using or selling these products for use in such
applications do so at their own risk.
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