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INA849 Datasheet(PDF) 3 Page - Texas Instruments

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Part # INA849
Description  PGA855 Low-Noise, Wide-Bandwidth, Fully Differential Output Programmable-Gain Instrumentation Amplifier
PDF  42 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

INA849 Datasheet(HTML) 3 Page - Texas Instruments

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5 Device Comparison Table
DEVICE
DESCRIPTION
GAIN EQUATION
RG PINS AT PIN
INA849
Ultra-low-noise (1-nV/√Hz), high-bandwidth instrumentation amplifier
G = 1 + 6 kΩ / RG
2, 3
INA851
Low-noise (3.2 nV/√Hz), high-speed (22 MHz), fully-differential instrumentation
amp with overvoltage protection (±40 V)
G = 1 + 6 kΩ / RG
2, 3
PGA280
20-mV to ±10-V programmable gain instrumentation amplifier with 3-V or 5-V
differential output; analog supply up to ±18 V
Digitally programmable with SPI
N/A
PGA281
Zero-drift, high-voltage programmable gain amplifier
Digitally pin-programmable
N/A
6 Pin Configuration and Functions
1
A2
12
FDA_IN+
2
IN+
11
OUT–
3
IN–
10
OUT+
4
A0
9
FDA_IN–
Not to scale
Thermal Pad
Figure 6-1. RGT Package, 16-Pin VQFN (Top View)
Table 6-1. Pin Functions
PIN
TYPE
DESCRIPTION
NAME
NO.
A0
4
Input
Gain option pin 0
A1
5
Input
Gain option pin 1
A2
1
Input
Gain option pin 2
DGND
16
Power
Ground reference for digital logic and gain setting pins
FDA_IN–
9
Input
Connection to output driver summing node
FDA_IN+
12
Input
Connection to output driver summing node
IN–
3
Input
Negative (inverting) input
IN+
2
Input
Positive (noninverting) input
LVDD
7
Power
Output driver positive supply. Connect this pin to the positive supply of the ADC to protect from overdriving.
LVSS
14
Power
Output driver negative supply. Connect this pin to the negative supply of the ADC to protect from overdriving.
NC
8
Do not connect
OUT–
11
Output
Output (inverting)
OUT+
10
Output
Output (noninverting)
VOCM
13
Input
Level set for output common mode value
VS+
6
Power
Input stage positive supply
VS–
15
Power
Input stage negative supply
Thermal Pad
Thermal pad
The thermal pad must be soldered to the printed-circuit board (PCB). Connect thermal pad to a plane or large
copper pour that is either floating or electrically connected to VS–, even for applications that have low power
dissipation.
www.ti.com
PGA855
SBOSAE0B – APRIL 2023 – REVISED SEPTEMBER 2023
Copyright © 2023 Texas Instruments Incorporated
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3
Product Folder Links: PGA855



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