Package Information

1

QFN33-16

All dimensions in millimeters.

Pin 1 Dot By Marking

3.000

± 0.05

0.500

± 0.05

Pin 1 Identification

C0.3

0.214

± 0.036

0.230

± 0.05

Top View

Bottom View

Side View

1

13

5

9

AAT2513

Dual 600mA Step-Down

Converter with Synchronization

22

2513.2007.04.1.1

Advanced Analogic Technologies, Inc.

830 E. Arques Avenue, Sunnyvale, CA 94085

Phone (408) 737- 4600

Fax (408) 737- 4611

© Advanced Analogic Technologies, Inc.

AnalogicTech cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an AnalogicTech product. No circuit patent licenses, copyrights, mask work

rights, or other intellectual property rights are implied. AnalogicTech reserves the right to make changes to their products or specifications or to discontinue any product or service with-

out notice. Except as provided in AnalogicTech’s terms and conditions of sale, AnalogicTech assumes no liability whatsoever, and AnalogicTech disclaims any express or implied war-

ranty relating to the sale and/or use of AnalogicTech products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent,

copyright or other intellectual property right. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the

customer to minimize inherent or procedural hazards. Testing and other quality control techniques are utilized to the extent AnalogicTech deems necessary to support this warranty.

Specific testing of all parameters of each device is not necessarily performed. AnalogicTech and the AnalogicTech logo are trademarks of Advanced Analogic Technologies Incorporated.

All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders.

1. The leadless package family, which includes QFN, TQFN, DFN, TDFN and STDFN, has exposed copper (unplated) at the end of the

lead terminals due to the manufacturing process. A solder fillet at the exposed copper edge cannot be guaranteed and is not required

to ensure a proper bottom solder connection.