AD8460 datasheet(13/75 Pages) AD

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Data Sheet

AD8460

analog.com

Rev.0

13 of 75

Thermal Resistance

Thermal performance is directly linked to PCB design and operating environment. Close attention to PCB thermal

design is required. To keep the junction temperature (TJ) below the absolute maximum rating, it is typically

required to incorporate thermal management techniques. See the Thermal Management section for more details.

θJA is the natural convection, junction-to-ambient thermal resistance. θJC is the junction-to-case thermal resistance.

Table 4. Thermal Resistance

Package Type1

θJA2

θJC3

θJC2

Unit

80-Lead TQFP (SV-80-7)

39.5

1.1

2.3

°C/W

Thermal impedance simulated values based on JEDEC JESD-51. For θJA with heatsink and airflow. See the Thermal

Management section.

Includes derating across the die.

Equal power dissipation across the die.

Electrostatic Discharge (ESD)

The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. Field induced charged device model (FICDM) per

ANSI/ESDA/JEDEC JS-002.

Table 5. AD8460 80-Lead TQFP

ESD Model

Withstand Threshold (V)

Class

HBM

± 1000

FICDM

± 1000

ESD Caution

ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can

discharge without detection. Although this product features patented or proprietary

protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore,

proper ESD precautions should be taken to avoid performance degradation or loss of

functionality.

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