USB3500 datasheet(46/46 Pages) SMSC

46 / 46 page

Hi-Speed USB Host, Device or OTG PHY With UTMI+ Interface

Datasheet

Revision 1.0 (04-04-05)

SMSC USB3500

DATASHEET

Chapter 8 Package Outline

The USB3500 is offered in a compact 56 lead QFN package.

Notes:

1. Controlling Unit: millimeter.

2. Dimension b applies to plated terminals and is measured between 0.15mm and 0.30mm from the

terminal tip. Tolerance on the true position of the leads is ± 0.05 mm at maximum material

conditions (MMC).

3. Details of terminal #1 identifier are optional but must be located within the zone indicated.

Figure 8.1 USB3500-ABZJ 56 Pin QFN Package Outline, 8 x 8 x 0.9 mm Body (Lead Free)

Table 8.1 56 Terminal QFN Package Parameters

MIN

NOMINAL

MAX

REMARKS

0.70

1.00

Overall Package Height

0.02

0.05

Standoff

0.60

0.90

Mold Thickness

0.20 REF

Copper Lead-frame Substrate

7.85

8.00

8.15

X Overall Size

7.55

7.95

X Mold Cap Size

2.25

4.5

6.80

X exposed Pad Size

7.85

8.00

8.15

Y Overall Size

7.55

7.95

Y Mold Cap Size

2.25

4.5

6.80

Y exposed Pad Size

0.30

0.55

Terminal Length

0.50 Basic

Terminal Pitch

0.18

0.30

Terminal Width

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