LT8277 datasheet(29/31 Pages) AD

29 / 31 page

Data Sheet

LT8277

analog.com

Rev 0

29 of 31

OUTLINE DIMENSIONS

3.00 ±0.05

1.50 REF

4.00 ±0.05

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40 ±0.10

BOTTOM VIEW—EXPOSED PAD

2.50 REF

1.00 BSC

0.75 ±0.05

R = 0.115

TYP

PIN 1

CHAMFER

C = 0.35

0.25 ±0.05

0.50 BSC

0.200 REF

0.00 – 0.05

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.70 ±0.05

0.25 ±0.05

2.50 REF

3.10 ±0.05

4.50 ±0.05

1.50 REF

2.10 ±0.05

3.50 ±0.05

PACKAGE OUTLINE

1.65 ±0.10

2.65 ±0.10

1.65 ±0.05

2.65 ±0.05

0.50 BSC

0.75 ±0.05

0.200 REF

0.00 – 0.05

0.203 REF

TERMINAL THICKNESS

TERMINAL LENGTH

0.40 ± 0.10

0.05 REF

PLATED AREA

DETAIL A

0.10 MIN

DETAIL A

0.275 REF

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