Data Sheet

ADPL20502

analog.com

Rev 0

23 of 27

OUTLINE DIMENSIONS

Table 5. Thermal Resistance of 8 TDFN-EP

Thermal Resistance, Four-Layer Board 9

Junction-to-Ambient (θJA)

85.3°C/W

Junction-to-Case Thermal Resistance (θJC)

8.9°C/W

Table 6. Thermal Resistance of 6-bump WLP

Thermal Resistance, Four-Layer Board 9

Junction-to-Ambient (θJA)

95.15°C/W

Junction-to-Case Thermal Resistance (θJC)

N/A

9

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a

four-layer board.