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33874 Datasheet(PDF) 5 Page - Freescale Semiconductor, Inc |
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33874 Datasheet(HTML) 5 Page - Freescale Semiconductor, Inc |
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5 / 37 page ![]() Analog Integrated Circuit Device Data Freescale Semiconductor 5 33874 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit ELECTRICAL RATINGS Operating Voltage Range Steady-State VPWR(SS) -16 to 41 V VDD Supply Voltage VDD -0.3 to 5.5 V Input/Output Voltage (1) See note (1) -0.3 to 7.0 V SO Output Voltage (1) VSO -0.3 to VDD+0.3 V WAKE Input Clamp Current ICL(WAKE) 2.5 mA CSNS Input Clamp Current ICL(CSNS) 10 mA HS [0:3] Voltage Positive Negative VHS 41 -16 V Output Current (2) IHS[0:3] 11 A Output Clamp Energy (3) ECL[0:3] 85 mJ ESD Voltage (4) Human Body Model (HBM) Charge Device Model (CDM) Corner Pins (1, 13, 19, 21) All Other Pins (2-12, 14-18, 20, 22-24) VESD ±2000 ±750 ±500 V THERMAL RATINGS Operating Temperature Ambient Junction TA TJ -40 to 125 -40 to 150 °C Storage Temperature TSTG -55 to 150 °C Thermal Resistance (5) Junction to Case Junction to Ambient RθJC RθJA <1.0 30 °C/W Peak Pin Reflow Temperature During Solder Mounting (6) TSOLDER 240 °C Notes 1. Exceeding voltage limits on IN[0:3], RST, FSI, CSNS, TEMP, SI, SO, SCLK, CS, or FS pins may cause a malfunction or permanent damage to the device. 2. Continuous high-side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output current using package thermal resistance is required. 3. Active clamp energy using single-pulse method (L = 2 mH, RL = 0 Ω, VPWR = 14 V, TJ = 150°C initial). 4. ESD testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), Charge Device Model (CDM), Robotic (CZAP = 4.0 pF). 5. Device mounted on a 2s2p test board per JEDEC JESD51-2. 6. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. |
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