TLV1812 datasheet(7/54 Pages) TI1

7 / 54 page

6.4 Thermal Information - Single

THERMAL METRIC(1)

TLV18x1-Q1

UNIT

DCK

(SC-70)

DBV

(SOT-23)

5 PINS

RθJA

Junction-to-ambient thermal resistance

226.6

203.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

129.5

105.4

°C/W

RθJB

Junction-to-board thermal resistance

78.6

106.6

°C/W

ψJT

Junction-to-top characterization parameter

51.5

54.0

°C/W

ψJB

Junction-to-board characterization parameter

78.3

106.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.

6.5 Thermal Information - Dual

THERMAL METRIC(1)

TLV18x2-Q1

UNIT

(SOIC)

(TSSOP)

DDF

(SOT-23)

DSG

(WSON)

DGK

(VSSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

136.1

187.5

170.4

79.9

178.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

76.8

76.7

90.3

100.1

66.4

°C/W

RθJB

Junction-to-board thermal resistance

79.7

118.1

88.1

46.4

100.0

°C/W

ψJT

Junction-to-top characterization parameter

26.8

14.4

7.5

5.3

9.2

°C/W

ψJB

Junction-to-board characterization parameter

78.9

116.4

87.6

46.4

98.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

–

21.6

–

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.

6.6 Thermal Information - Quad

THERMAL METRIC(1)

TLV18x4-Q1

UNIT

(SOIC)

(TSSOP)

DYY

(SOT-23)

RTE

(WQFN)

14 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

104.2

124.1

119.9

53.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

60.3

52.4

60.6

58.6

°C/W

RθJB

Junction-to-board thermal resistance

60.2

67.2

79.0

29.0

°C/W

ψJT

Junction-to-top characterization parameter

20.7

7.5

3.3

2.2

°C/W

ψJB

Junction-to-board characterization parameter

59.8

66.6

41.2

28.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

–

13.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.

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TLV1811-Q1, TLV1821-Q1, TLV1812-Q1, TLV1822-Q1

TLV1814-Q1, TLV1824-Q1

SNOSDC9B – OCTOBER 2022 – REVISED SEPTEMBER 2023

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Product Folder Links: TLV1811-Q1 TLV1821-Q1 TLV1812-Q1 TLV1822-Q1 TLV1814-Q1 TLV1824-Q1

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