Analog Integrated Circuit Device Data

Freescale Semiconductor

5

33291

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Thermal Resistance

Junction-to-Ambient (Natural Convection, Single-Layer Board) (12), (13)

Junction-to-Ambient (Natural Convection, Four-Layer Board) (12), (14)

Junction to Board (15)

68

44

20

°C/W

Notes

12.

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

13.

Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.

14.

Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

15.

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8.

Table 3. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Rating

Symbol

Value

Unit