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VD66GY Datasheet(PDF) 20 Page - STMicroelectronics |
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VD66GY Datasheet(HTML) 20 Page - STMicroelectronics |
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20 / 37 page ![]() Figure 11. Application schematic 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 115 114 111 112 113 101 102 103 104 105 106 107 108 109 110 Cann ot VANA_2V8 \ o e p p e m n - f s i t l . e st AGND AGND DGND DGND DGND DGND VCORE_1V1 AGND VANA_2V8 VANA_2V8 VANA_2V8 VDDIO_1V8 VDDIO_1V8 VDDIO_1V8 AGND VCORE_1V1 VCORE_1V1 VCORE_1V1 DGND PORTST VANA_2V8 CPNEG DGND DATA2N DATA2P CLKN CLKP DATA1N DATA1P CSI2 CSI2 GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 XSHUTDOWN CLKIN SDA SCL Host Interface CLKIN Host Interface GPIO7 GPIO6 GPIO5 GPIO4 GPIO3 GPIO2 GPIO1 GPIO0 SDA SCL XSHUTDOWN VDDIO_1V8 C_LDO2V4 AGND VCORE_1V1 VANA_2V8 AGND C_CPNEG LDO2V4 VDDIO_1V8 DGND C_VDDIO DGND C_VCORE VCORE_1V1 VANA_2V8 AGND C_VANA Power supp ly decoup ling C_CPPOS AGND CPPOS VDDAMP DGND C_VDDAMP AGND DGND 6.2 Layout guidelines For good PCB design practice, observe the following image sensor layout: • Use power and ground planes to supply power to the sensor. • Join grounds i.e. join AGND and DGND into one single, solid GND plane underneath the sensor. • Connect this GND plane to the sensor pins with one via per GND pin. • To minimize risk of emissions, shield all vias and tracks attached to supplies by their respective GND nets. • Maximize copper fill on the power planes near the sensor and use vias to improve heat transfer from the sensor. Consider including additional heatsinks close to the sensor if it is to be used at high temperatures. • Route the high-speed signal pairs of the MIPI CSI-2 interface with balanced and controlled impedance differential traces (50 Ω single-ended impedance, 100 Ω differential impedance). This is a requirement for high-speed signaling. Route each pair together and match them in length to target a maximum 10 ps skew. VCPNEG_IN and VCPNEG_OUT must be connected together with a short track. The required decoupling capacitor shall be placed on this path and not on an isolated track. VCPPOS_IN and VCPPOS_OUT must be connected together with a short track. The required decoupling capacitor shall be placed on this path and not on an isolated track. VD66GY Application schematic DS13838 - Rev 7 page 20/37 |
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